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The Complete Reball Process: From Start to Finish

Updated: Jan 2

I. What is the Reball - Remake Chip Service


Reballing refers to replacing the solder balls on a chip package. It is typically performed when the original solder balls have become damaged, degraded, or need to be replaced for any reason. Reballing is commonly done on integrated circuit (IC) chips, such as CPUs, GPUs, FPGAs, where the chip is removed from the circuit board, the old solder balls are removed, and new solder balls are applied to the chip. This process requires specialized equipment and skills to ensure proper alignment and soldering of the new balls. Reballing chip services are often used in electronics repair and manufacturing industries to salvage or restore chips with solder ball-related issues.

Remaking refers to the process of redesigning or reproducing electronic boards. This may involve making changes to the original board design to improve performance, address issues, or incorporate new features. Remaking electronic boards can also refer to manufacturing a new batch of boards to replace damaged or faulty ones. The process includes modifying the circuitry, layout, components, or firmware boards to achieve the desired outcome.



II. How does Osprey Electronics do Reball - Remake ?


Osprey Electronics makes Reball - Remake services following steps by steps below:

Step 1: Accumulating new/old chips or damaged boards from clients

Currently We supported VU35P, VU33P, VU9P and VU13P

* In the case of clients sending us chips only. Here are our supports footprints:

* In the case of clients sending us boards, we support Reball - Remake from these board models below:


Step 2: Mark chip by laze printing

For sure, clients will be concerned about whether Osprey Electronics might mix up chips among different clients. Our assurance is that this will never happen. When we receive chips or boards from clients, our first step is to label the edge of the chips using laser printing technology

Step 3: Take out chips from the boards

Step 4: Check the quality of chips with a special tool

To ensure that your chips are suitable for remaking, we have conducted thorough research and developed a specialized tool. This tool assists us in evaluating the condition of your chips and determining their suitability for the remaking process. Once this assessment is complete, we proceed to step 5.

Step5: SMT

The main chips (VU9P, VU13P, VU33P, VU35P) will be integrated with numerous electronic components. Our contracted SMT factory cutting-edge technology machine enables the automatic soldering of these components, ensuring precise and efficient assembly.


Step 6: Checking the quality of boards by x-ray machine and function testing

After wave soldering, we use an X-ray machine to check the quality of the soldering points again. It is time-consuming. However, Osprey always put quality on the top priority.

We also check the software functions of each board in this step as well.


Step7: Coating board

For staying away from the power short-cut issue due to frost or dust. All of the reballed boards will be coated with special paint. Clients don’t need to pay any extra cost for this step


Step 8: Assembly and packaging

Assembly:

Based on the number of chips per client and type of fans, we will classify and assemble to E100, E200, E300 miner.

For further information and support, please reach out to us through the chat box on our website at https://www.ospreyelectronics.io/ or send us an email at support@ospreyelectronics.io We’re here to assist you!


Disclaimer: Our reball service, while conducted with utmost care and expertise, is not immune to a certain margin of error. In the event of reball failure, the client assumes the associated risks. We do not provide a guarantee of 100% success but strive to deliver the highest quality service possible.

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